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- Präsentation_HPCi_Fraunhofer_IWS.pdf (12.0M) 15회 다운로드 DATE : 2022-11-01 09:06:45
독일 프라운호퍼연구소 전문가 초청 한독소재센터 세미나가 2022년 11월 10일(목) 14시에 한국재료연구원에서 개최됩니다.
Fraunhofer IWS (Institute for Material and Beam Technology)의 Bonding and Fiber Composite Technology 그룹장이신 Dr. Maurice Langer 와 KIST + ESCHERICH GmbH의 Ms. Annett Klotzbach 께서
접착제나 나사 등을 사용하지 않고 몇 초안에 다양한 재료를 접합시킬 수 있는 기술을 소개하며
한국 파트너와 협력기회에 대해 논의하기 위해 개최됩니다.
일자: 2022년 11월 10일(목) 14:00 – 16:00
장소: 한국재료연구원 본관동 1층 세미나실
(주소: 경남 창원시 창원대로 797 (상남동 66번지) )
Efficient multi-material lightweight design thanks to sustainable connection technology:
Thermal direct joining of metal to plastics
CV: Dr. Maurice Langer
Mr. Langer started his scientific career at the Technical University of Dresden after graduating in mechanical engineering. The focus of his work was the development of industrial bonding processes. After moving to the Fraunhofer Institute for Material and Beam Technology, he focused on electrically conductive bonding for use in battery technology, where he successfully completed his doctorate on this topic in 2021. Mr. Langer currently leads the Adhesive Bonding and Fiber Composite Technology workgroup in the business unit Ablation and Joining. Currently his research focuses on laser welding of composite materials and joining dissimilar materials such as metal with plastic.
CV: Annett Klotzbach
Ms. Klotzbach studied mechanical engineering and started her professional career at the Fraunhofer Institute for material and beam technology IWS Dresden. The focus of her work was developing processes and system technology for the treatment of metal and composite materials with high-power lasers. Since 2016, she has been mainly involved in the development of innovative joining processes for composites and metal components. In 2021, Ms. Klotzbach moved to the company KIST+ESCHERICH, where she is responsible for establishing the Hybrid Joining business unit. Her responsibilities include, in particular, project acquisition and customer support for the thermal direct joining process marketed under the name hyJOIN®.